Soares, D., Vilarinho, C., Barbosa, J., Silva, R. and Castro, F. 2005. Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder. Revista de Metalurgia. 41, Extra (Dec. 2005), 208–212. DOI:https://doi.org/10.3989/revmetalm.2005.v41.iExtra.1026.