Soares, D., C. Vilarinho, J. Barbosa, R. Silva, and F. Castro. “Effect of the Bismuth Content on the Interface Reactions Between Copper Substrate and Sn-Zn-Al-Bi Lead-Free Solder”. Revista De Metalurgia, vol. 41, no. Extra, Dec. 2005, pp. 208-12, doi:10.3989/revmetalm.2005.v41.iExtra.1026.