Hot flow of a commercial-purity copper

Authors

  • V. G. García Dpto. de Ciencia de los Materiales e Ingeniería Metalúrgica, ETSEIB. Universitat Politécnica de Catalunya
  • M. El Wahabi Dpto. de Ciencia de los Materiales e Ingeniería Metalúrgica, ETSEIB. Universitat Politécnica de Catalunya
  • J. M. Cabrera Dpto. de Ciencia de los Materiales e Ingeniería Metalúrgica, ETSEIB. Universitat Politécnica de Catalunya
  • L. M. Riera Tertub S.L. Barcelona
  • J. M. Prado Dpto. de Ciencia de los Materiales e Ingeniería Metalúrgica, ETSEIB. Universitat Politécnica de Catalunya

DOI:

https://doi.org/10.3989/revmetalm.2001.v37.i2.461

Keywords:

Hot deformation, Copper, Hot flow modeling, Dynamic recrystallization, Dynamic recovery,

Abstract


The objective of the study is to model the flow curve at high temperature of a commercialpurity copper which contains 297 ppm of phosphorus. For this purpose a theoretical model is applied to derive a constitutive equation that reliably predicts the behaviour at higher strain rates than experimentally tested. The test temperature range was from 873 K to 1223 K in increments of 50 K, using six true strain rates at every temperature, which span from 0.3 s-1 to 0.001 s-1 The hot flow tests were performed on a copper with a relatively large grain size (637 µm) but of similar scale to pertinent industrial processes. This metal presents two antagonistic phenomena during the hot working: strain hardening and softening by dynamic restoration, which in turns can be divided into dynamic recovery and dynamic recrystallization. A quantification of the mentioned mechanisms is done through the use of physically based constitutive equations.

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Published

2001-04-30

How to Cite

García, V. G., El Wahabi, M., Cabrera, J. M., Riera, L. M., & Prado, J. M. (2001). Hot flow of a commercial-purity copper. Revista De Metalurgia, 37(2), 177–183. https://doi.org/10.3989/revmetalm.2001.v37.i2.461

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Articles