Enhancing Copper Coatings with Graphene Nanoplatelets by Electrodeposition

María M. Peña Pérez; César Escobar Claros; Lucía Pérez Gandarillas; Ángel Yedra Martínez; Laura Soriano Martín

doi:10.3989/revmetalm.e294.1758

Authors

María M. Peña Pérez Centro Tecnológico CTC, Scientific and Technological Park of Cantabria (PCTCAN) https://orcid.org/0009-0004-6090-5677
César Escobar Claros Centro Tecnológico CTC, Scientific and Technological Park of Cantabria (PCTCAN) https://orcid.org/0000-0003-0736-3536
Lucía Pérez Gandarillas Department of Chemistry and Process and Resources Engineering, Universidad de Cantabria https://orcid.org/0000-0002-5357-5102
Ángel Yedra Martínez Centro Tecnológico CTC, Scientific and Technological Park of Cantabria (PCTCAN) https://orcid.org/0000-0002-9387-7332
Laura Soriano Martín Centro Tecnológico CTC, Scientific and Technological Park of Cantabria (PCTCAN) https://orcid.org/0009-0003-4914-8516

DOI:

https://doi.org/10.3989/revmetalm.e294.1758

Keywords:

Cu-GNP coating, Direct current, Electrodeposition, Hardness, Pulse reverse current

Abstract

Copper–graphene nanoplatelet (Cu–GNP) composite coatings were electrodeposited onto nickelplated steel substrates using direct current (DC) and pulse reverse current (PRC) techniques. The influence of the deposition regime on microstructure, nanoplatelet incorporation, and mechanical performance was investigated. Optical microscopy revealed that PRC deposition produced more homogeneous and refined microstructures compared to DC deposition. Raman spectroscopy confirmed the successful incorporation of graphene nanoplatelets within the copper matrix. Microhardness measurements showed a significant improvement in mechanical performance, with PRC coatings reaching an increase of 69.7% compared to DCdeposited coatings. The enhanced hardness is attributed to grain refinement, improved nanoplatelet dispersion, and effective dispersion strengthening mechanisms activated under pulse reverse conditions.

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