Compressive plastic deformation of polycrystalline Si3N4: considerations on the solution-reprecipitation model and on the cavity-formation model
DOI:
https://doi.org/10.3989/revmetalm.2001.v37.i2.483Keywords:
Creep, Silicon nitride, High temperature,Abstract
Compressive creep of silicon nitride has been studied in several commercial and experimental grades of creep-resistant Si3N4. The temperature range was 1400-1500°C, and inert atmosphere was used to avoid long-term degradation of the samples. The creep rates at a given temperature showed more than one order of magnitude of grade to grade variability. Microstructural analysis showed the presence of cavities after deformation. When analyzed by a classic power-law equation the creep parameters n= 1 for all the grades, while Q varied from 444 to 951 kJ/mol. The activity of diffusional mechanisms is discussed. Alternatively, the results have been analyzed by means of the Luecke-Wiederhorn cavitation model.
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