Hot flow of a commercial-purity copper
Keywords:Hot deformation, Copper, Hot flow modeling, Dynamic recrystallization, Dynamic recovery,
The objective of the study is to model the flow curve at high temperature of a commercialpurity copper which contains 297 ppm of phosphorus. For this purpose a theoretical model is applied to derive a constitutive equation that reliably predicts the behaviour at higher strain rates than experimentally tested. The test temperature range was from 873 K to 1223 K in increments of 50 K, using six true strain rates at every temperature, which span from 0.3 s-1 to 0.001 s-1 The hot flow tests were performed on a copper with a relatively large grain size (637 µm) but of similar scale to pertinent industrial processes. This metal presents two antagonistic phenomena during the hot working: strain hardening and softening by dynamic restoration, which in turns can be divided into dynamic recovery and dynamic recrystallization. A quantification of the mentioned mechanisms is done through the use of physically based constitutive equations.
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