Tin-silver and tin-copper alloys for capillarity joining -sol ft soldering- of copper piping

Authors

  • J. Durán Dpto. Ingeniería de materiales. Degradación y Durabilidad. CENIM (CSIC) Madrid
  • J. M. Amo Dpto. Ingeniería de materiales. Degradación y Durabilidad. CENIM (CSIC) Madrid
  • C. M. Durán Dpto. Ingeniería de materiales. Degradación y Durabilidad. CENIM (CSIC) Madrid

DOI:

https://doi.org/10.3989/revmetalm.2001.v37.i2.491

Keywords:

Capillarity bondings, Copper piping, Service failures, Tin-silver and tin-copper alloys, Defects, Bonding temperatures,

Abstract


It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bondings. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints.

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Published

2001-04-30

How to Cite

Durán, J., Amo, J. M., & Durán, C. M. (2001). Tin-silver and tin-copper alloys for capillarity joining -sol ft soldering- of copper piping. Revista De Metalurgia, 37(2), 336–343. https://doi.org/10.3989/revmetalm.2001.v37.i2.491

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Articles