Electroless copper deposition on alumina substrates
DOI:
https://doi.org/10.3989/revmetalm.1998.v34.iExtra.716Keywords:
Electroless, Copper, Alumina, Adherence, Nickel activationAbstract
A method for obtaining copper coatings on ceramic tenacious substrates as the alumina is described. Its principal applications are found in the electronic industry; they can also be employed as interlayer on metal-ceramic disimilar bondings produced by solid state welding or brazing. Optimal activation conditions were determined as well as the influence of the substrate surface preparation and the deposition rate on the adhesion. The kinetics study of the process was carried out by gravimetric and electrochemical methods.
Downloads
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 1998 Consejo Superior de Investigaciones Científicas (CSIC)
This work is licensed under a Creative Commons Attribution 4.0 International License.
© CSIC. Manuscripts published in both the printed and online versions of this Journal are the property of Consejo Superior de Investigaciones Científicas, and quoting this source is a requirement for any partial or full reproduction.
All contents of this electronic edition, except where otherwise noted, are distributed under a “Creative Commons Attribution 4.0 International” (CC BY 4.0) License. You may read the basic information and the legal text of the license. The indication of the CC BY 4.0 License must be expressly stated in this way when necessary.
Self-archiving in repositories, personal webpages or similar, of any version other than the published by the Editor, is not allowed.
