Electroless copper deposition on alumina substrates
Keywords:Electroless, Copper, Alumina, Adherence, Nickel activation
A method for obtaining copper coatings on ceramic tenacious substrates as the alumina is described. Its principal applications are found in the electronic industry; they can also be employed as interlayer on metal-ceramic disimilar bondings produced by solid state welding or brazing. Optimal activation conditions were determined as well as the influence of the substrate surface preparation and the deposition rate on the adhesion. The kinetics study of the process was carried out by gravimetric and electrochemical methods.
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