Modelling of the formation of WC-Co coatings by HVOF spraying onto copper substrates
Keywords:HVOF spraying, WC-Co coating, Copper substrate, Heat transfer, Structure
Present paper deals with the mathematical simulation of the heat transfer between a WC-Co coating and a copper substrate during HVOF spraying. This modelling includes the investigation of temperature variation, coating solidification, melting and subsequent solidification in the substrate interfacial region and specific features of the substrate-coating thermal interaction. The results obtained are used for modelling of the development of the coating structure and adhesion during HVOF spraying of the WC-Co powder on a copper substrate. Two types of substrate were considered: smooth (polished) and rough. Variations of solidification times, solidification velocity, thermal gradient and cooling velocity in the coating and substrate interfacial region are studied. Development of the amorphous and crystalline structures in the coating and of the crystalline structure in the substrate interfacial region is discussed. Behaviour of the crystal size and intercrystalline distance with respect to the thermal spray parameters and morphology of the substrate surface is analyzed. Optimal conditions for the formation of fine and dense crystalline structure are determined. Structural changes in the solid state of the substrate occurring because of heating and rapid cooling are considered. Mechanical and thermal mechanisms of development of the substrate-coating adhesion are discussed. Results obtained agree well with experimental data.
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